TY  - BOOK
AU  - Jaccodine, R.
AU  - Jackson, K.A
AU  - Sundahl, R.C
TI  - Electronic packaging materials science III: symposium held November 30-December 4, 1987 
SN  - 0931837766
AV  - DUCE TK7870.E218 
PY  - 1988///
CY  - Pittsburg
PB  - Material Research Society
KW  - Science
KW  - Material science
N1  - Includes Index
ER  -